A good PCB layout for the LMK03000CISQ/NOPB involves keeping the clock input traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the crystal oscillator. Additionally, it's recommended to use a 4-layer PCB with a dedicated ground plane to reduce noise and EMI.
To ensure proper power and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) between VDD and GND, and a 10 μF capacitor between VDDA and GND. Place these capacitors as close to the device as possible. Additionally, use a 1 μF capacitor between VDD and VDDA to decouple the analog and digital power domains.
For optimal performance, use a high-quality crystal oscillator with a frequency of 25 MHz or 30 MHz, and a load capacitance of 10 pF to 20 pF. Ensure the crystal oscillator is placed close to the device and connected to the XIN and XOUT pins.
To configure the LMK03000CISQ/NOPB for a specific clock frequency, use the device's internal PLL to multiply the input clock frequency. Consult the datasheet for the specific PLL configuration and multiplication factors required for your desired output frequency.
The LMK03000CISQ/NOPB has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid exposing the device to extreme temperatures during storage or operation.
LMK03000CISQ/NOPB datasheet
by Texas Instruments
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