Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general best practices for high-frequency PCB design, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise.
The choice of input and output capacitors depends on the specific application and operating conditions. In general, X7R or X5R ceramic capacitors with a voltage rating of at least 2x the maximum input voltage are recommended. The output capacitor should be chosen based on the desired output ripple and noise performance.
The LMP7707 is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. It's also important to consider the thermal resistance of the package and the PCB when designing for high-temperature operation.
To ensure EMC, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, consider using a common-mode choke or ferrite bead to reduce electromagnetic interference (EMI).
The recommended power-up sequence is to apply the input voltage (VIN) before enabling the device (EN pin). This ensures that the internal voltage regulators are properly initialized and reduces the risk of latch-up or other startup issues.