A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from TI provides additional recommendations.
To ensure a stable and accurate output voltage, it's essential to follow the recommended capacitor selection and placement guidelines, and to ensure that the input voltage is within the recommended range. Additionally, the output voltage can be adjusted using the ADJ pin, and the datasheet provides a formula to calculate the required resistor values.
Exceeding the maximum input voltage rating can cause permanent damage to the device, including overheating, electrical overstress, and even physical damage to the internal components. It's essential to ensure that the input voltage remains within the recommended range to prevent damage and ensure reliable operation.
The thermal shutdown feature is designed to protect the device from overheating. When the device exceeds the thermal shutdown threshold, it will shut down to prevent damage. To handle this feature, ensure good airflow around the device, use a heat sink if necessary, and monitor the device temperature to prevent overheating.
The LMZ10505TZX-ADJ/NOPB is designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). To further reduce EMI and RFI, use proper PCB layout techniques, such as separating analog and digital grounds, and using shielding and filtering components as needed.
LMZ10505TZX-ADJ/NOPB datasheet
by Texas Instruments
