The recommended layout and routing for the LP5521 involves keeping the power traces as short and wide as possible, and using a solid ground plane to reduce noise and EMI. It's also important to keep the analog and digital sections separate to minimize noise coupling.
To optimize the LP5521's performance, you should consider factors such as the input voltage, output current, and switching frequency. You can use TI's WEBENCH Power Designer tool to simulate and optimize the design for your specific application.
The LP5521 has a thermal pad that must be connected to a solid ground plane to dissipate heat. You should also ensure good airflow around the device and avoid blocking the airflow with other components. The maximum junction temperature is 150°C.
To troubleshoot issues with the LP5521, start by checking the input voltage, output voltage, and current. Use an oscilloscope to check for noise and ringing on the output. Check the layout and routing for any issues, and ensure that the device is properly soldered and connected.
The LP5521 is a switching regulator that can generate EMI. To minimize EMI, use a shielded inductor, keep the layout compact, and use a common-mode choke. Ensure that the device meets the relevant EMC standards for your application.
LP5521TM/NOPB datasheet
by Texas Instruments
