LPC1102UK datasheet by NXP Semiconductors

Description Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Active
ECCN 3A991.A.2
HTS Code 8542.31.00.01
Schedule B 8542.31.00.00
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