The maximum operating temperature range for the LPC2292FBD144,551 is -40°C to +85°C.
The clock settings for the LPC2292FBD144,551 can be configured using the PLL (Phase-Locked Loop) and the Clock Generation Unit (CGU). The PLL can be used to generate a clock frequency up to 60 MHz, and the CGU can be used to divide the clock frequency to generate the desired clock speed for the processor and peripherals.
The maximum current consumption of the LPC2292FBD144,551 depends on the operating frequency and the peripherals used. According to the datasheet, the maximum current consumption is around 450 mA at 60 MHz with all peripherals enabled.
A bootloader for the LPC2292FBD144,551 can be implemented using the In-System Programming (ISP) feature. The ISP feature allows the microcontroller to be programmed using a serial interface. The bootloader can be implemented using a combination of hardware and software, and it typically involves using a serial communication protocol such as UART or I2C to communicate with the host system.
The main difference between the LPC2292FBD144,551 and the LPC2294FBD144,551 is the amount of flash memory and SRAM. The LPC2292FBD144,551 has 256 KB of flash memory and 16 KB of SRAM, while the LPC2294FBD144,551 has 512 KB of flash memory and 32 KB of SRAM. Additionally, the LPC2294FBD144,551 has more peripherals and features, such as a USB interface and a CAN interface.
LPC2292FBD144,551 datasheet
by NXP Semiconductors
