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    Part Img LPC2362FBD100 datasheet by NXP Semiconductors

    • Single-chip 16-bit/32-bit MCU; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC
    • Original
    • Yes
    • Yes
    • Not Recommended
    • 3A991.A.2
    • 8542.31.00.01
    • 8542.31.00.00
    • Find it at Findchips.com
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    LPC2362FBD100 datasheet preview

    LPC2362FBD100 Frequently Asked Questions (FAQs)

    • The internal oscillator can be configured to run up to 72 MHz, but the maximum clock frequency that can be achieved depends on the specific application and the quality of the external crystal used. Typically, it is recommended to use an external crystal oscillator to achieve frequencies above 48 MHz.
    • To configure the USB interface to work in device mode, you need to set the USB_MODE pin high, enable the USB clock, and configure the USB registers to enable device mode. You also need to implement the necessary USB device firmware to handle USB requests and respond to USB commands.
    • Yes, the LPC2362FBD100 has an external memory interface that can be used to connect to external memory devices such as SRAM, NOR flash, or NAND flash. The external memory interface is configurable and can be used to expand the microcontroller's memory capabilities.
    • To implement a bootloader on the LPC2362FBD100, you need to create a firmware that can load and execute code from an external memory device such as a serial flash or a USB drive. The bootloader firmware needs to be stored in the microcontroller's internal flash memory and configured to start executing at reset. You also need to implement the necessary protocols to communicate with the external memory device and load the application code.
    • The maximum current that can be sourced or sunk by the GPIO pins of the LPC2362FBD100 is 4 mA per pin. However, the total current sourced or sunk by all GPIO pins should not exceed 100 mA to avoid overheating the microcontroller.
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