A good PCB layout for the MAX13433EESD+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
The MAX13433EESD+T requires a single 3.3V or 5V power supply. It's recommended to power the device with a clean, low-noise power supply. The power sequencing requirements are not critical, but it's recommended to power the device after the power supply has stabilized.
The MAX13433EESD+T can achieve data rates of up to 100 Mbps, but the actual data rate may vary depending on the specific application and system design.
The MAX13433EESD+T can be configured for half-duplex or full-duplex operation by setting the appropriate pins high or low. For half-duplex operation, the TXEN pin should be tied high, and for full-duplex operation, the TXEN pin should be tied low.
The MAX13433EESD+T has built-in ESD protection features that can withstand electrostatic discharges of up to ±15kV on the RS-232 inputs and ±8kV on the CMOS inputs.
