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    Part Img MAX138CPL+ datasheet by Maxim Integrated Products

    • 3 1/2 Digit ADC with Reference, Charge Pump, and Direct LED Drivers
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    MAX138CPL+ datasheet preview

    MAX138CPL+ Frequently Asked Questions (FAQs)

    • The MAX138CPL+ is a high-frequency device, so it's essential to follow good high-frequency PCB design practices. Keep the input and output traces short and away from noise sources. Place the device close to the power source, and use a solid ground plane to reduce noise and radiation. Refer to the Maxim Integrated Products application note AN1991 for more detailed layout and placement guidelines.
    • The MAX138CPL+ requires a stable voltage supply and proper biasing to operate correctly. Ensure the input voltage (VIN) is within the recommended range (2.7V to 5.5V), and the output voltage (VOUT) is set to the desired level using the feedback resistors (RFB1 and RFB2). Also, make sure the bias pin (BIAS) is connected to a stable voltage source, typically the output voltage (VOUT).
    • The MAX138CPL+ can deliver up to 150mA of output current. However, the actual output current capability depends on the input voltage, output voltage, and the device's thermal conditions. Be sure to check the device's thermal derating and power dissipation calculations to ensure reliable operation.
    • The MAX138CPL+ has a built-in noise reduction circuit, but additional filtering may be necessary depending on the application. You can add external capacitors (e.g., 10uF to 100uF) in parallel with the output to reduce ripple and noise. Additionally, consider using a pi-filter (L-C-L) or a common-mode choke to further attenuate high-frequency noise.
    • The MAX138CPL+ is rated for operation up to 125°C (TJ). However, the device's performance and reliability may degrade at high temperatures. Be sure to check the device's thermal derating and power dissipation calculations to ensure reliable operation in your specific application. If high-temperature operation is required, consider using a thermally enhanced package or a heat sink to reduce the device's junction temperature.
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