MAX147BCPP+ datasheet by Maxim Integrated Products

MAX147BCPP+ Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the MAX147BCPP+?
  The recommended PCB layout for the MAX147BCPP+ involves placing the device near the power source, using a solid ground plane, and keeping the input and output traces short and separate to minimize noise and EMI. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
• How do I ensure the MAX147BCPP+ is properly decoupled?
  To ensure proper decoupling, place a 10uF ceramic capacitor between the VIN pin and the GND pin, and a 1uF ceramic capacitor between the VCC pin and the GND pin. Additionally, use a 100nF ceramic capacitor between the BYPASS pin and the GND pin.
• What is the maximum input voltage that the MAX147BCPP+ can handle?
  The MAX147BCPP+ can handle input voltages up to 18V, but it is recommended to operate within the specified input voltage range of 4.5V to 16V for optimal performance and reliability.
• How do I configure the MAX147BCPP+ for a specific output voltage?
  The MAX147BCPP+ output voltage can be configured by connecting the FB pin to a resistive divider network between the output voltage and ground. The resistive divider ratio determines the output voltage, and the recommended ratio is 1.21V / (VOUT - 1.21V).
• What is the thermal derating for the MAX147BCPP+?
  The MAX147BCPP+ has a thermal derating of 12.5mW/°C above 25°C. This means that the device's power dissipation must be reduced as the ambient temperature increases to prevent overheating.