The MAX1672EEE is a high-frequency device, so it's essential to follow good layout and placement practices to minimize noise and ensure proper operation. Maxim recommends keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is also recommended.
The MAX1672EEE has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure that the thermal pad is soldered to the PCB and connected to a large copper area to dissipate heat efficiently. Additionally, keep the device away from heat sources and ensure good airflow around the device.
The recommended input capacitor value is 10uF to 22uF, and it should be a low-ESR ceramic capacitor. The capacitor should be placed close to the VIN pin and connected to the GND pin. A larger capacitor value can be used, but it may affect the startup time and stability of the device.
To ensure stability, follow the recommended layout and placement guidelines, use a low-ESR input capacitor, and keep the output capacitor value within the recommended range (10uF to 100uF). Additionally, ensure that the output voltage is within the recommended range (2.5V to 5.5V) and the output current is within the recommended range (up to 500mA).
The recommended output capacitor value is 10uF to 100uF, and it should be a low-ESR ceramic or tantalum capacitor. The capacitor should be placed close to the VOUT pin and connected to the GND pin. A larger capacitor value can be used, but it may affect the startup time and stability of the device.
MAX1672EEE datasheet
by Maxim Integrated Products
