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    Part Img MAX1722EZK-T datasheet by Maxim Integrated Products

    • 1.5uA IQ, Step-Up DC-DC Converters in Thin SOT23-5
    • Original
    • No
    • No
    • Obsolete
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    MAX1722EZK-T datasheet preview

    MAX1722EZK-T Frequently Asked Questions (FAQs)

    • The recommended layout and placement for the MAX17222EZK-T involves placing the device close to the battery, using a solid ground plane, and keeping the input and output traces short and wide to minimize noise and EMI. Additionally, it's recommended to place a 10uF ceramic capacitor between the IN and GND pins, and a 1uF ceramic capacitor between the OUT and GND pins.
    • To optimize the performance of the MAX17222EZK-T, it's recommended to follow the application guidelines in the datasheet, including selecting the correct input and output capacitors, setting the correct output voltage, and ensuring proper thermal management. Additionally, it's recommended to simulate the design using SPICE models and to perform thorough testing and validation to ensure the device meets the required specifications.
    • The MAX17222EZK-T has a thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. To ensure reliable operation, it's recommended to keep the device junction temperature below 125°C. This can be achieved by providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device.
    • To troubleshoot issues with the MAX17222EZK-T, it's recommended to follow a systematic approach, including checking the input voltage, output voltage, and current, as well as verifying the correct configuration of the device. Additionally, it's recommended to check for any signs of physical damage, such as overheating or electrical overstress, and to consult the datasheet and application notes for guidance.
    • The MAX17222EZK-T is designed to meet EMI and EMC requirements, but it's still important to follow good design practices to minimize EMI and EMC issues. This includes using a solid ground plane, keeping the input and output traces short and wide, and using shielding and filtering as necessary. Additionally, it's recommended to follow the guidelines in the datasheet and application notes for EMI and EMC compliance.
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