The recommended PCB layout for the MAX3157EAI-T involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the crystal oscillator. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
The MAX3157EAI-T requires a single 3.3V power supply, and it's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the power supply is within the recommended operating range of 3.0V to 3.6V.
The recommended crystal oscillator frequency for the MAX3157EAI-T is 25MHz, and it's recommended to use a high-quality crystal oscillator with a load capacitance of 18pF to 22pF. The crystal selection should be based on the desired frequency accuracy, stability, and ESR (equivalent series resistance) requirements.
The MAX3157EAI-T can be configured for different baud rates and data formats using the SPI interface. The device supports baud rates from 300bps to 1Mbps, and data formats such as 8-N-1, 8-E-1, and 8-O-1. The configuration is done by writing to the device's registers using the SPI interface.
The MAX3157EAI-T has a maximum junction temperature of 150°C, and it's recommended to keep the device temperature below 125°C for optimal performance and reliability. Thermal management considerations include using a heat sink, thermal vias, and thermal pads to dissipate heat, as well as ensuring good airflow around the device.
MAX3157EAI-T datasheet
by Maxim Integrated Products
