A good PCB layout for the MAX5590BEUG+ involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
The MAX5590BEUG+ requires a single 2.7V to 5.5V power supply. It's recommended to power the device with a clean, low-noise power supply, and to ensure that the power supply is stable before applying signals to the device. The power sequencing requirements are not critical, but it's recommended to power the device after the power supply has stabilized.
The MAX5590BEUG+ can drive capacitive loads up to 100pF. However, it's recommended to limit the capacitive load to 10pF to 20pF to ensure optimal performance and stability.
The output voltage of the MAX5590BEUG+ can be adjusted by using an external resistor divider network connected to the FB pin. The output voltage can be calculated using the formula: VOUT = 1.25V x (R1 + R2) / R2, where R1 and R2 are the resistors in the divider network.
The MAX5590BEUG+ has a thermal derating of 6.4mW/°C above 25°C. To ensure reliable operation at high temperatures, it's recommended to provide adequate heat sinking, use a thermally conductive PCB material, and ensure good airflow around the device.
MAX5590BEUG+ datasheet
by Maxim Integrated Products
