MAX5890EGK+D datasheet by Maxim Integrated Products

MAX5890EGK+D Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the MAX5890EGK+D to minimize noise and ensure optimal performance?
  A good PCB layout for the MAX5890EGK+D involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure optimal performance.
• How do I ensure the MAX5890EGK+D is properly powered and what are the power sequencing requirements?
  The MAX5890EGK+D requires a single 2.7V to 5.5V power supply. It's recommended to power the device with a clean, low-noise power supply, and to sequence the power-on in the following order: VCC, then AVCC, and finally DVCC. The power-down sequence should be reversed.
• What is the maximum capacitive load that the MAX5890EGK+D can drive?
  The MAX5890EGK+D can drive a maximum capacitive load of 100pF. Exceeding this limit may cause instability or oscillations in the device.
• How do I configure the MAX5890EGK+D for optimal EMI performance?
  To configure the MAX5890EGK+D for optimal EMI performance, use a low-pass filter on the output, keep the device away from noise sources, and use a shielded cable for the output. Additionally, use a common-mode choke or a ferrite bead on the output to reduce EMI emissions.
• What is the thermal derating of the MAX5890EGK+D and how does it affect the device's performance?
  The MAX5890EGK+D has a thermal derating of 6.4mW/°C above 25°C. This means that the device's power dissipation must be reduced as the temperature increases to prevent overheating and ensure reliable operation.