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    Part Img MAX9693ESE+ datasheet by Maxim Integrated Products

    • Linear - Comparators, Integrated Circuits (ICs), IC COMPARATOR W/LE 16-SOIC
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    MAX9693ESE+ datasheet preview

    MAX9693ESE+ Frequently Asked Questions (FAQs)

    • The recommended PCB layout for the MAX9693ESE+ is to use a 4-layer board with a solid ground plane on the bottom layer, and to keep the analog and digital signals separate to minimize noise and interference. Additionally, it's recommended to use a low-ESR capacitor for the output filter and to place it as close as possible to the IC.
    • To optimize the output filter design for the MAX9693ESE+, you should choose a capacitor with a low equivalent series resistance (ESR) and a high quality factor (Q). The recommended output filter configuration is a 2nd-order LC filter with a series inductor and a shunt capacitor. The values of the inductor and capacitor should be chosen based on the desired cutoff frequency and impedance of the filter.
    • The maximum input voltage that the MAX9693ESE+ can handle is 5.5V. Exceeding this voltage may cause damage to the IC or affect its performance. It's recommended to use a voltage regulator or a voltage limiter to ensure that the input voltage does not exceed the maximum rating.
    • Common issues with the MAX9693ESE+ include oscillations, noise, and output voltage errors. To troubleshoot these issues, check the PCB layout and ensure that it meets the recommended layout guidelines. Also, verify that the input voltage and output load are within the specified ranges. Use an oscilloscope to measure the output voltage and current, and check for any signs of oscillation or noise.
    • The MAX9693ESE+ is rated for operation up to 125°C. However, the IC's performance and reliability may be affected at high temperatures. It's recommended to derate the output current and voltage at high temperatures to ensure reliable operation. Additionally, the IC's thermal pad should be connected to a heat sink or a thermal via to dissipate heat effectively.
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