The recommended PCB layout for the MBR1060CT-G1 is to use a symmetrical layout with the device centered on the PCB, and to use a solid ground plane to reduce thermal resistance and electromagnetic interference (EMI).
To ensure reliable operation of the MBR1060CT-G1 in high-temperature environments, it is recommended to use a heat sink with a thermal resistance of less than 10°C/W, and to keep the junction temperature below 150°C.
The maximum allowable voltage stress on the MBR1060CT-G1 is 1.5 times the rated voltage, but it is recommended to keep the voltage stress below 1.2 times the rated voltage to ensure reliable operation.
To protect the MBR1060CT-G1 from electrical overstress (EOS), it is recommended to use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) in parallel with the device, and to ensure that the PCB layout is designed to minimize parasitic inductance and capacitance.
The recommended storage condition for the MBR1060CT-G1 is to store the devices in a dry, cool place with a temperature range of -40°C to 125°C, and a relative humidity of less than 60%.
MBR1060CT-G1 datasheet
by Diodes Incorporated
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