The recommended PCB footprint for the MBRB10100CT-13 is a standard SOT23 package footprint with a minimum pad size of 0.8mm x 0.8mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation of the MBRB10100CT-13 in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal relief, and ensuring that the device is operated within its specified temperature range.
The maximum allowable voltage stress on the MBRB10100CT-13 is 100V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
Yes, the MBRB10100CT-13 can be used in high-frequency applications up to 100MHz. However, it is recommended to follow proper layout and design guidelines to minimize parasitic inductance and capacitance, and to ensure that the device is operated within its specified frequency range.
To handle ESD protection for the MBRB10100CT-13, it is recommended to follow proper ESD handling and storage procedures, including using ESD-safe materials and equipment, and ensuring that the device is properly grounded during handling and assembly.
