MBRB10200CT-13 datasheet by Diodes Incorporated

MBRB10200CT-13 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the MBRB10200CT-13?
  The recommended PCB footprint for the MBRB10200CT-13 is a standard SOT-23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
• Can I use the MBRB10200CT-13 in a high-temperature environment?
  The MBRB10200CT-13 is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliability. Consult the datasheet for thermal derating information.
• How do I ensure the MBRB10200CT-13 is properly soldered to the PCB?
  Follow the recommended soldering profile and use a solder with a melting point above 217°C to ensure reliable connections. Avoid overheating the device during soldering.
• What is the maximum surge current rating for the MBRB10200CT-13?
  The MBRB10200CT-13 can withstand surge currents up to 100A for 10ms, but it's recommended to limit the surge current to 50A for 10ms to ensure reliability.
• Can I use the MBRB10200CT-13 in a high-frequency switching application?
  The MBRB10200CT-13 is suitable for high-frequency switching applications up to 100kHz, but it's recommended to consult the datasheet for switching loss information and to ensure the device is properly snubbed to prevent ringing.