The recommended PCB footprint for the MBRB10H100-E3/45 is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a solder mask defined gap of 0.2 mm around the pad.
To ensure reliable soldering of the MBRB10H100-E3/45, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the thermal stress on the component, and avoid applying excessive force or vibration during the soldering process.
The maximum allowable voltage derating for the MBRB10H100-E3/45 is 80% of the rated voltage, which is 80% of 100 V = 80 V. This means that the component should not be operated at a voltage exceeding 80 V to ensure reliable operation and prevent premature failure.
The MBRB10H100-E3/45 is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings at higher temperatures to ensure reliable operation. Consult the datasheet and application notes for specific guidance on high-temperature operation.
Handle the MBRB10H100-E3/45 with care to prevent mechanical damage and electrostatic discharge (ESD). Store the components in their original packaging or in a shielded container, and avoid exposing them to extreme temperatures, humidity, or physical stress during shipping and storage.
MBRB10H100-E3/45 datasheet
by Vishay Semiconductors
Findchips
