The recommended PCB footprint for MBRB20150CT-13 is a standard SOT-23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a 0.5mm spacing between pads.
Yes, MBRB20150CT-13 is rated for operation up to 150°C, but it's recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet to ensure reliable operation.
To ensure the reliability of MBRB20150CT-13, follow the recommended storage and handling procedures, use a clean and dry PCB assembly process, and perform thorough testing and inspection during production.
Yes, MBRB20150CT-13 is suitable for high-frequency switching applications up to 100 kHz, but it's recommended to consider the device's switching characteristics, such as turn-on and turn-off times, and ensure that the application's switching frequency is within the device's capabilities.
The recommended soldering profile for MBRB20150CT-13 is a peak temperature of 260°C for 10 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.
MBRB20150CT-13 datasheet
by Diodes Incorporated
