The recommended PCB footprint for the MBRB3045CT is a standard SOT-23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress, such as reflow soldering or wave soldering.
The maximum operating temperature range for the MBRB3045CT is -55°C to 150°C, with a storage temperature range of -55°C to 175°C.
To handle ESD protection, use a wrist strap or mat that is grounded to prevent static electricity from damaging the device. Also, use ESD-sensitive handling and storage procedures, and consider using ESD protection devices such as TVS diodes or ESD arrays.
The recommended voltage derating for the MBRB3045CT is to operate the device at a voltage that is at least 10% to 20% below the maximum rated voltage to ensure reliable operation and to prevent overheating.
MBRB3045CT datasheet
by Vishay Semiconductors
