MBRB30H45CTHE3/81 datasheet by Vishay Semiconductors

MBRB30H45CTHE3/81 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the MBRB30H45CTHE3/81?
  The recommended PCB footprint for the MBRB30H45CTHE3/81 is a rectangular pad with dimensions of 3.3mm x 1.4mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
• How do I ensure reliable soldering of the MBRB30H45CTHE3/81?
  To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Also, make sure to follow the recommended soldering profile and avoid overheating the component.
• What is the maximum operating temperature range for the MBRB30H45CTHE3/81?
  The maximum operating temperature range for the MBRB30H45CTHE3/81 is -55°C to 150°C, with a derating of 1.33mΩ/°C above 25°C.
• Is the MBRB30H45CTHE3/81 suitable for high-frequency applications?
  Yes, the MBRB30H45CTHE3/81 is suitable for high-frequency applications up to 1GHz, with a low inductance of 0.5nH and a high-frequency resistance of 0.5Ω.
• How do I handle ESD protection for the MBRB30H45CTHE3/81?
  To handle ESD protection for the MBRB30H45CTHE3/81, use a wrist strap or mat with a resistance of 1MΩ to 10MΩ, and ensure that the component is stored in an ESD-protected environment.