The recommended PCB layout for the MBRF10200CT involves placing the device close to the power source, using a solid ground plane, and minimizing the length of the leads to reduce inductance. Additionally, it is recommended to use a Kelvin connection for the sense pins to improve accuracy.
To ensure proper thermal management, it is recommended to attach the MBRF10200CT to a heat sink or a metal pad on the PCB, and to use thermal interface material (TIM) to fill any gaps. The device's thermal pad should be soldered to the PCB to provide a good thermal path.
The maximum allowed voltage on the sense pins of the MBRF10200CT is 6V, which is the absolute maximum rating. However, it is recommended to keep the sense voltage below 5V to ensure accurate current sensing.
Yes, the MBRF10200CT can be used in high-frequency switching applications, but it is essential to consider the device's bandwidth and rise time. The device's bandwidth is 100 kHz, and the rise time is 1.5 μs. It is recommended to use a filter or a buffer to condition the output signal if the switching frequency is above 100 kHz.
The power dissipation of the MBRF10200CT can be calculated using the formula: Pd = (Vcc x Icc) + (Rsense x Isense^2), where Vcc is the supply voltage, Icc is the quiescent current, Rsense is the sense resistance, and Isense is the sense current. The maximum power dissipation is 1.5W.
MBRF10200CT datasheet
by Diodes Incorporated
