The recommended PCB footprint for the MBRF1545CT-E3/45 is a standard SOT23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
The MBRF1545CT-E3/45 is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliability. Consult the datasheet for thermal derating information.
Follow the recommended soldering profile and use a solder with a melting point above 217°C to ensure a reliable joint. Avoid overheating the component during soldering.
Yes, the MBRF1545CT-E3/45 is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
The typical turn-on time for the MBRF1545CT-E3/45 is around 10-20 ns, but this can vary depending on the specific application and circuit conditions.