The recommended PCB footprint for the MBRF20100CT-E3/4W is a rectangular pad with dimensions of 3.3mm x 1.4mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
Yes, the MBRF20100CT-E3/4W is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device, such as using a soldering iron with a low thermal mass or a hot air soldering technique.
The recommended storage condition for the MBRF20100CT-E3/4W is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the devices in direct sunlight or near sources of moisture.
Yes, the MBRF20100CT-E3/4W is designed to withstand vibrations up to 10g peak acceleration, making it suitable for use in high-vibration applications such as automotive or industrial control systems.