The recommended PCB footprint for the MDA100G is a standard SOD-123 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm. A thermal pad is also recommended to improve heat dissipation.
To ensure reliable operation of the MDA100G in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature below 150°C.
The maximum surge current rating for the MDA100G is 100A for a duration of 10ms. However, it is recommended to derate the surge current based on the operating temperature and other environmental factors.
Yes, the MDA100G can be used in parallel to increase the current handling capability, but it is recommended to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and premature failure.
The recommended storage condition for the MDA100G is in a dry, cool place with a temperature range of -40°C to 30°C and a relative humidity of 60% or less. The devices should be stored in their original packaging or in a similar anti-static package to prevent damage from electrostatic discharge.
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