A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Use the device's power-down mode, reduce the clock frequency, and optimize the voltage regulator module (VRM) design to minimize power consumption.
Handle the device in an ESD-controlled environment, use anti-static wrist straps and mats, and follow the JEDEC standard for ESD protection.
Use a logic analyzer or oscilloscope to capture signal waveforms, and consult the device's errata document and application notes for troubleshooting guidance.
The device can operate within a temperature range of -40°C to 125°C, and can withstand mechanical stresses of up to 1000 cycles of 10-90% relative humidity and 5-40°C temperature cycling.
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