MGA-61563-TR2G datasheet by Avago Technologies

MGA-61563-TR2G Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  The recommended PCB layout involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing thermal vias under the device. For thermal management, a heat sink or thermal pad is recommended to keep the junction temperature below 125°C.
• How do I ensure electromagnetic compatibility (EMC) and reduce electromagnetic interference (EMI) with this device?
  To ensure EMC and reduce EMI, use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, follow good PCB design practices, such as using a solid ground plane and minimizing loop areas.
• What are the reliability and MTBF (mean time between failures) expectations for this device?
  The MGA-61563-TR2G has a typical MTBF of 100 million hours at 40°C, calculated according to Telcordia SR-332. The device is also qualified to automotive and industrial reliability standards, ensuring high reliability in harsh environments.
• Can I use this device in a high-temperature environment, and what are the limitations?
  The MGA-61563-TR2G is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade above 85°C. It's essential to follow the recommended thermal management guidelines and derate the device's performance accordingly.
• What are the recommended test and measurement procedures for this device?
  Use a high-impedance probe or a 50-ohm terminated cable to measure the device's output. Ensure the test setup is properly calibrated, and use a low-noise power supply to minimize measurement errors. Follow the recommended test procedures outlined in the datasheet and application notes.