A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. Use thermal pads or a heat sink for high-power applications.
Use the device's low-power modes (e.g., sleep mode) and adjust the bias voltage to minimize current consumption. Implement power gating and clock gating to reduce power consumption during idle periods.
Set the internal voltage regulators to 1.2V for the core and 1.8V for the I/O. Adjust the voltage regulators based on the specific application's power requirements and noise sensitivity.
Use a shielded enclosure, implement proper grounding and shielding, and ensure a minimum of 10mm clearance between the device and other components. Follow the datasheet's guidelines for PCB layout and component placement.
Use a network analyzer or spectrum analyzer to measure the device's frequency response and noise figure. Perform S-parameter measurements to verify the device's impedance matching and gain.
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