A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal copper plane or the backside of the PCB.
Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Also, consider derating the device's current handling capability at high temperatures.
A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. The device is also compatible with wave soldering and hand soldering.
Handle the device with an anti-static wrist strap or mat. Use ESD-protected packaging and storage materials. Ground all equipment and tools before handling the device.
Store the device in a dry, cool place (below 30°C and 60% relative humidity). Avoid exposure to direct sunlight, moisture, and contaminants.
MMSTA42-7-F datasheet
by Diodes Incorporated
