The recommended power-up sequence is to apply power to the VCC and VDD cores simultaneously, followed by the VDDA and VDDIO supplies. This ensures proper initialization and prevents damage to the device.
The clocking system can be configured using the Clock Generation Module (CGM) and the System Integration Module (SIM). The CGM generates the clock signals, while the SIM controls the clock distribution. Refer to the device's reference manual for detailed configuration options.
The maximum operating temperature range for the MPC855TVR50D4R2 is -40°C to 105°C (industrial temperature range). However, it's essential to ensure proper thermal management and heat dissipation to prevent overheating and maintain reliable operation.
The MPC855TVR50D4R2 supports DDR memory interface through the DDR Controller (DDRC). To implement DDR memory interface, configure the DDRC registers, set up the memory timings, and ensure proper signal routing and termination. Refer to the device's reference manual and DDR memory datasheet for detailed implementation guidelines.
The Boot Mode Pins (BMODE[2:0]) determine the boot mode of the device. They select the boot source, such as flash memory, serial peripheral interface (SPI), or other external devices. Proper configuration of the BMODE pins ensures correct boot-up and initialization of the device.
MPC855TVR50D4R2 datasheet
by Freescale Semiconductor
