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    MPXC2011DT1 datasheet by Freescale Semiconductor

    • MPXC2011DT1 Chip Pak High Volume Sensor for Low Pressure Applications
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
    • 8542.31.00.01
    • 8542.31.00.00
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    MPXC2011DT1 datasheet preview

    MPXC2011DT1 Frequently Asked Questions (FAQs)

    • A recommended PCB layout is to use a 4-layer board with a solid ground plane, and to keep the sensor's analog output traces as short as possible and away from digital signals. Additionally, use a 10nF capacitor between the VCC and GND pins to filter out noise.
    • Calibration involves applying a known pressure and measuring the output voltage. The sensor has an internal offset and span calibration. The offset calibration is done by applying 0 kPa and measuring the output voltage, while the span calibration is done by applying a known pressure (e.g., 100 kPa) and measuring the output voltage. The calibration coefficients can then be calculated and stored in the microcontroller.
    • The maximum pressure rating for the MPXC2011DT1 is 200 kPa (29 psi). Exceeding this pressure may damage the sensor or affect its accuracy.
    • The MPXC2011DT1 has a built-in temperature sensor. To compensate for temperature effects, the temperature data can be used to correct the pressure reading. The datasheet provides a temperature compensation formula, which can be implemented in the microcontroller to correct the pressure reading.
    • The recommended power-on sequence is to apply VCC first, followed by a delay of at least 10ms, and then apply the input voltage to the pressure port. This ensures proper initialization of the sensor and prevents damage.
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