MSPM101C104 datasheet by TE Connectivity

MSPM101C104 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the MSPM101C104?
  TE Connectivity recommends a 4-layer PCB with a solid ground plane and a separate power plane for the module. The layout should also ensure minimal inductance and capacitance in the power paths.
• How do I ensure the reliability of the MSPM101C104 in high-temperature applications?
  To ensure reliability, it's essential to follow the recommended derating guidelines for temperature, voltage, and current. Additionally, ensure good thermal management, such as using a heat sink or thermal interface material, to keep the module within its operating temperature range.
• What are the EMI and RFI considerations for the MSPM101C104?
  The MSPM101C104 is designed to meet CISPR 22 and FCC Part 15 Class B emissions standards. To minimize EMI and RFI, use a shielded enclosure, keep cables and wires away from the module, and ensure good grounding and shielding of the PCB.
• Can I use the MSPM101C104 in a redundant or parallel configuration?
  Yes, the MSPM101C104 can be used in redundant or parallel configurations to achieve higher power output or redundancy. However, it's essential to follow the recommended design guidelines and ensure proper synchronization and control of the modules.
• What are the storage and handling precautions for the MSPM101C104?
  Handle the MSPM101C104 with care to prevent damage from electrostatic discharge, physical shock, or vibration. Store the module in its original packaging, away from direct sunlight, moisture, and extreme temperatures.