MTU1S1205MC-R datasheet by Murata Power Solutions

MTU1S1205MC-R Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the MTU1S1205MC-R?
  Murata recommends a land pattern with a pad size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The recommended land pattern is available in the Murata documentation or can be obtained from the manufacturer's website.
• How do I handle the thermal considerations for the MTU1S1205MC-R?
  The MTU1S1205MC-R has a thermal resistance of 10°C/W. To ensure reliable operation, it is recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. The PCB should also be designed to dissipate heat efficiently, with a minimum of 1 oz copper thickness and a thermal via structure.
• What is the maximum operating temperature range for the MTU1S1205MC-R?
  The MTU1S1205MC-R has an operating temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade at temperatures above 85°C. It is recommended to operate the device within the recommended temperature range to ensure optimal performance and reliability.
• How do I ensure the MTU1S1205MC-R is properly soldered to the PCB?
  To ensure proper soldering, it is recommended to follow the Murata recommended soldering profile, which includes a peak temperature of 260°C and a dwell time of 30 seconds. The PCB should also be designed with a solder mask and a solder paste with a melting point of at least 217°C.
• What is the recommended storage and handling procedure for the MTU1S1205MC-R?
  The MTU1S1205MC-R should be stored in a dry, cool place, away from direct sunlight and moisture. The device should be handled with anti-static precautions, such as using an anti-static wrist strap or mat. The device should not be exposed to temperatures above 40°C or humidity above 60% during storage.