The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the copper traces wide and short can help to reduce thermal resistance.
To ensure reliable start-up of the device in a high-noise environment, it is recommended to add a capacitor (e.g. 10nF) between the VIN pin and GND to filter out noise, and to use a soft-start circuit to limit the inrush current during start-up.
The maximum allowed voltage on the EN pin is 6V, exceeding which can cause damage to the device. It is recommended to use a voltage divider or a clamp circuit to limit the voltage on the EN pin to within the recommended range.
To optimize the compensation network for the best transient response, it is recommended to use the recommended component values and layout guidelines provided in the datasheet, and to adjust the compensation network based on the specific application requirements and PCB layout.
The recommended input capacitor type is a low-ESR ceramic capacitor (e.g. X5R or X7R) with a value of 10uF to 22uF. The input capacitor should be placed as close as possible to the VIN pin to minimize the inductance of the connection.
NCP1622AEASNT1G datasheet
by onsemi
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