The recommended land pattern for the NTCS0805E3473JHT is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3473JHT has a thermal resistance of 350°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The NTCS0805E3473JHT has an MSL rating of 1, which means it can withstand normal humidity levels without special handling or storage requirements.
Yes, the NTCS0805E3473JHT is suitable for high-frequency applications up to 100 MHz. However, ensure that the component is properly decoupled and that the PCB layout is optimized for high-frequency operation.
To ensure reliability in a harsh environment, follow proper handling and storage procedures, and ensure that the component is operated within its specified temperature and voltage ratings. Additionally, consider using conformal coating or potting to protect the component from environmental stresses.
