The recommended PCB footprint for NTDS015N15MCT4G is a standard SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature below the maximum rated value of 150°C.
The maximum allowed voltage on the gate of NTDS015N15MCT4G is ±20V, with a recommended maximum voltage of 15V to ensure reliable operation and prevent damage to the device.
Yes, NTDS015N15MCT4G can be used in switching applications, but it is recommended to follow proper switching guidelines, such as using a gate driver, minimizing switching losses, and ensuring the device is operated within its safe operating area (SOA).
The power dissipation of NTDS015N15MCT4G can be calculated using the formula Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.
NTDS015N15MCT4G datasheet
by onsemi
