NTE0303MC-R datasheet by Murata Power Solutions

NTE0303MC-R Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Murata recommends a PCB layout with a solid copper plane underneath the module, and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
• Can I use this module in a high-vibration environment?
  Yes, the NTE0303MC-R is designed to withstand vibrations up to 10G peak acceleration, but it's recommended to follow Murata's guidelines for vibration testing and to perform additional testing for your specific application.
• How do I ensure the module's reliability in high-temperature environments?
  Murata recommends following their derating guidelines for temperature, and ensuring good airflow around the module. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation.
• What is the recommended input capacitor value and type for this module?
  Murata recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, and a voltage rating of at least 25V. The capacitor should be placed as close to the module's input pins as possible.
• Can I use this module in a redundant or parallel configuration?
  Yes, but it's recommended to follow Murata's guidelines for redundant and parallel configurations, and to perform additional testing to ensure the modules operate correctly in your specific application.