Murata recommends a PCB layout with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range (–40°C to +125°C) and that the PCB is designed to minimize thermal resistance. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
Murata recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. The device should be soldered using a no-clean or water-soluble flux, and the PCB should be cleaned after soldering to prevent corrosion.
To prevent damage, store the devices in their original packaging or in a protective container to prevent mechanical stress and electrostatic discharge (ESD). Avoid exposing the devices to extreme temperatures, humidity, or physical shock during shipping and storage.
Handle the devices in an ESD-protected environment, and use ESD-protective packaging and materials. Ground yourself before handling the devices, and avoid touching the device pins or leads. Store the devices in a dry, cool place, away from direct sunlight and moisture.
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