A good PCB layout for OPA2107AU/2K5 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
To ensure stability, use a gain resistor (Rg) that is at least 1 kΩ, and a feedback capacitor (Cf) that is at least 10 pF. Additionally, ensure that the output impedance of the previous stage is low enough to drive the input of the OPA2107AU/2K5.
The maximum power dissipation of OPA2107AU/2K5 is 670 mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to calculate the power dissipation and ensure it's within the safe operating area.
While OPA2107AU/2K5 is rated for operation up to 125°C, its performance may degrade at high temperatures. Ensure that the device is properly heat-sinked, and consider derating the power dissipation to ensure reliable operation.
To protect OPA2107AU/2K5 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite beads on the input and output lines. Additionally, ensure that the PCB layout is designed to minimize radiation and susceptibility.
OPA2107AU/2K5 datasheet
by Texas Instruments
