Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane to reduce noise and electromagnetic interference (EMI). A 4-layer PCB with a dedicated ground plane is recommended.
To ensure stability, use a compensation capacitor (Cc) between the output and the inverting input, and a series resistor (Rs) at the output. The values of Cc and Rs depend on the specific application and can be calculated using Texas Instruments' stability analysis tools or simulation software.
The maximum power dissipation of OPA2338EA/250 is 500 mW. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
Yes, OPA2338EA/250 can operate in high-temperature environments, but its performance and reliability may be affected. The device is specified to operate up to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Above 125°C, the device's offset voltage, noise, and distortion may increase, and its lifetime may be reduced.
To protect OPA2338EA/250 from EMI and RFI, use a shielded enclosure, keep the device away from sources of interference, and use filtering components such as ferrite beads or RC filters at the input and output. Additionally, use a low-pass filter at the output to reduce high-frequency noise and oscillations.
OPA2338EA/250 datasheet
by Texas Instruments
