A good PCB layout for OPA4743UA/2K5 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. TI provides a recommended layout in the datasheet and application notes.
The choice of gain resistors depends on the desired gain, input impedance, and output impedance. TI provides a gain resistor calculator tool and application notes to help with the selection. Additionally, the datasheet provides guidelines for selecting gain resistors.
The maximum power dissipation of OPA4743UA/2K5 is dependent on the ambient temperature and the thermal resistance of the package. The datasheet provides a power dissipation calculation formula and a thermal resistance value. Typically, the maximum power dissipation is around 1.4W at 25°C ambient temperature.
OPA4743UA/2K5 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. TI provides guidance on high-temperature operation in the datasheet and application notes. It's essential to consider the device's thermal limitations and take necessary precautions when operating in high-temperature environments.
To protect OPA4743UA/2K5 from EMI, use proper shielding, grounding, and layout techniques. Keep the device away from high-frequency sources, use ferrite beads or chokes on the power lines, and consider using EMI filters or shielding cans. TI provides guidance on EMI protection in the datasheet and application notes.
OPA4743UA/2K5 datasheet
by Texas Instruments
