A good PCB layout for OPA704NA/3K involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
To ensure stability, ensure that the gain is set to a value that does not exceed the recommended maximum gain, and that the feedback network is properly compensated. Additionally, use a capacitor in the feedback path to compensate for the op-amp's internal capacitance.
The maximum power dissipation of OPA704NA/3K is 670mW. However, this value can be affected by the ambient temperature, so it's essential to consider the thermal characteristics of the device and the PCB when designing the system.
While OPA704NA/3K is rated for operation up to 125°C, its performance may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper heat sinking to maintain reliability.
To protect OPA704NA/3K from EMI, use shielding, filtering, and grounding techniques. Ensure that the PCB layout is designed to minimize radiation and susceptibility to EMI, and consider using EMI filters or shielding components.