NXP recommends a PCB layout with a solid ground plane and thermal vias under the device to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the PCB.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
Although the datasheet specifies the recommended operating voltage range, it's essential to note that the absolute maximum rating for the input pins is 6.5V. Exceeding this voltage may cause permanent damage to the device.
While PDTC123ET is suitable for high-frequency switching applications, it's crucial to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency is within the device's recommended operating range.
To troubleshoot issues with the thermal shutdown feature, check the device's thermal design and layout, ensure proper heat sinking, and verify that the thermal shutdown threshold is not exceeded. Also, consult the datasheet for specific guidance on thermal shutdown operation and troubleshooting.
PDTC123ET datasheet
by NXP Semiconductors
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