NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance and ensure proper heat dissipation.
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 3.0V to 5.0V.
The PDTC144WE,115 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
NXP recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
PDTC144WE,115 datasheet
by NXP Semiconductors
