NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is typically limited to the supply voltage (VCC) + 0.5V to prevent damage to the internal ESD protection diodes.
To prevent ESD damage, handle the devices by the body or use an anti-static wrist strap, and ensure that the assembly process follows ESD-safe guidelines. It's also recommended to use ESD protection devices, such as diodes or resistors, on the input pins if they are not already integrated into the PDZ20B,115.
To prevent moisture damage, store the devices in their original packaging or in a dry, nitrogen-filled environment with a relative humidity below 50%. Avoid exposing the devices to temperatures above 30°C or relative humidity above 60% for extended periods.
PDZ20B,115 datasheet
by NXP Semiconductors
