A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Use a minimum of 50 mils of clearance around the device for heat dissipation.
Use a heat sink with a thermal resistance of less than 10°C/W. Ensure good airflow around the device. Derate the output current by 1.5 mA/°C above 85°C. Use a thermal interface material with a thermal conductivity of at least 1 W/m-K.
The maximum allowed voltage on the EN pin is 6 V. Exceeding this voltage may damage the device. Use a voltage divider or a level shifter if the control signal is higher than 6 V.
Use a shielded cable for the output. Add a ferrite bead or a common-mode choke to the output cable. Ensure good grounding of the device and the PCB. Use a layout that minimizes loop areas and reduces radiation.
Use a 10 μF to 22 μF ceramic capacitor with an X7R or X5R dielectric. The capacitor should be placed as close as possible to the VIN pin. Avoid using electrolytic capacitors due to their higher equivalent series resistance (ESR).
Findchips
