The recommended PCB layout for optimal performance can be found in the application note AN-111 from Diodes Incorporated, which provides guidelines for PCB design, layout, and thermal management.
To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal management guidelines provided in the datasheet, including using a heat sink and ensuring good airflow around the device. Additionally, the device should be operated within the specified temperature range and derated accordingly.
The maximum allowable voltage stress on the PI6LC48H02-01LIE is specified in the datasheet as 3.6V. Exceeding this voltage may cause damage to the device or affect its reliability.
To handle ESD protection during handling and assembly, it is recommended to follow standard ESD handling procedures, including using ESD-safe materials, grounding oneself, and using ESD-protective packaging. The device should also be handled in a static-protected environment.
The recommended soldering profile for the PI6LC48H02-01LIE can be found in the datasheet or in the Diodes Incorporated soldering guide, which provides guidelines for reflow soldering, wave soldering, and hand soldering.
PI6LC48H02-01LIE datasheet
by Diodes Incorporated
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