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STMicroelectronics recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
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Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure good airflow and avoid blocking the airflow around the device.
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A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor, placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
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Choose an output capacitor with low ESR (Equivalent Series Resistance) and high ripple current rating. A 10uF to 22uF X7R or X5R ceramic capacitor is suitable for most applications. Consider the output voltage, current, and ripple requirements when selecting the capacitor.
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Keep the high-current paths (VIN, VOUT, and GND) short, wide, and away from sensitive analog signals. Use a solid copper plane for the GND connection and avoid using vias under the device to minimize inductance and noise.